Description

A monochamber high vacuum furnace can be used for baking elements and components in HV conditions. For those applications double chamber walls channeling and baffles provide the most effective method of water cooling to provide a 'cold wall'. Consists of: water cooled, stainless steel vacuum chamber with doors equipped with viton® gasket and internal Cu lining with corresponding substrate shelves.

Application

Periodic baking of the vacuum components is performed to maximize the quality of the chamber vacuum. Baking of the chamber attachments is required to prevent the formation of cold spots to which particles and elements would migrate and become plated out. Baking requires that all materials used inside the vacuum chamber, and not recessed in ports, shall be able to withstand baking temperatures up to 450°C. This requirement does not apply if it can be demonstrated that the maximum temperature to which these materials are exposed during baking will be less than 450°C. All hardware attached to or located directly inside the first flange of the vacuum chamber shall be capable of being baked to 250°C. Any hardware attached directly to the chamber, out to the first isolation valve (if used), shall also be equipped with provisions for baking. These provisions include thermal insulation and possibly heating elements to ensure that temperatures in the range 200÷250°C (150÷200°C at viton® seals) can be achieved during bakeout . Further, all devices and metallic tubing attached to, and capable of being opened to the chamber, shall be reviewed to determine the need for individual baking.

The UHV chamber flanges:

• 1 x DN 100CF - for turbo-molecular pump
• 1 x DN 40CF - for vacuum sensor
• 1 x DN 40CF - spare
• 1 x DN 16CF - for thermocouple feed-through

Heating in the furnace is controlled by a dedicated controller Bakeout Control Unit BCU13.